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The Butterfly Laser Automatic Coupling System is an automatic coupling device designed specifically for butterfly-packaged components. It is ideally suited for coupling and packaging scenarios where optical fibers are inserted into the butterfly package housing. The system effectively addresses the challenges of precise fiber threading, flexible clamping, and high-efficiency coupling packaging. It is compatible with various packaging processes, including adhesive bonding, glass soldering, and laser welding.

The Dual-FA Automatic Coupling Equipment is a self-developed system compatible with both TX and RX ends. It automatically adjusts the relative parallelism between the PCB and the FA, simultaneously performs TX-end FA butt coupling and RX-end FA vertical coupling (with TX and RX on the same endface), and supports automatic dispensing and UV curing. This equipment is suitable for a wide range of materials including silicon photonics, thin-film lithium niobate, and III-V compound semiconductors.

The Dual-Lens Automatic Coupling & Packaging System is designed for lens coupling and optical path shaping. Equipped with image recognition and positioning capabilities, the system enables automated loading, automatic dispensing, and UV curing. It supports a wide range of materials, including silicon photonics, thin-film lithium niobate, and III-V compound semiconductors. With the integration of different peripheral equipment, it can also accommodate various packaging processes such as AuSn soldering, glass soldering, and laser welding. The system features a modular design, allowing it to adapt to different lens and device specifications with simple fixture changes, offering broad applicability and strong scalability.

The COB Automatic Coupling System is a self-developed COB coupling device featuring one-click operation, easy pneumatic gripper loading, and visual alignment correction. It is designed for active COB products with multimode 850nm wavelength, such as 400G/800G SR4 optical transceivers. The system automatically identifies PCB position and angle, performs automatic parallel alignment, and carries out automatic coupling with a coupling cycle time of less than 120 seconds. It is also equipped with automatic dispensing and UV curing functions. The equipment offers user-friendly operation, a high degree of automation, and excellent consistency.

The Chip Test System is a testing platform independently developed by Wuhan Laile Optoelectronics Technology Co., Ltd. It is primarily designed for CHIP testing and can be integrated with spectral measurement to output LIV, spectral data, and divergence angle data in a consolidated manner. The system is widely used in volume production testing for DFB, EML, and SOA devices.

The COC chip coupling test system is a testing platform independently developed by Wuhan Laile Optoelectronics Technology Co., Ltd. It is mainly used to achieve COC coupling and testing, and can integrate spectral measurement, output LIV, spectral data, divergence angle data, etc. The equipment is widely used in COC/COS mass production testing of DFB EML SOA.